Topic: Plasma treatment for wire bonding. Super-fine cleaning, removal of carbohydrates, cleaning PCBs (lead frame).
Secure Joining–Reliable Wire Bonding with Plasma Cleaning of Contact Surfaces
After
chips are created
(diced out of the wafer) and separated, they are packaged by
attaching them to lead frames and then providing them with housings.
Secure joining, wire bonding, of the chip to the leads of the lead
frame is critical for the reliable functioning of the integrated
circuit. Wire bonding is generally performed in an ultrasound
procedure, and for that step in the process, the contact surfaces
must be perfectly clean.
Plasma activation for secure adhesion of electronic components and cable insulation sheathsDry
super-fine cleaning with Openair® Plasma reliably removes all
contaminants and carbohydrate residues. The result is secure bonding
and a significant reduction in error rates.
