In the electronics industry, Openair® Plasma pretreatment is a key asset for achieving cost-effectiveness and process reliability. For transparent, scratch-proof coating of displays, it significantly reduces the reject rate and ensures a flawless appearance. When printing electrically conductive coatings on printed circuit boards, prior plasma activation, microfine cleaning and electrostatic discharge ensure that the coating will adhere securely. In chip packaging, Openair® microfine cleaning eliminates the need for a vacuum chamber.
DICHT! (Nr. 4/2016)
DICHT! (No. 4 /2016)