The special challenges of electronics manufacturing
Electronics manufacturing can be particularly demanding because of the need for extreme efficiency, the need to achieve reliable conductivity and the need to solder components to circuit boards where the heat can damage them. In the case of the etching of chips, absolute cleanliness is also demanded.

In order to clean, etch or solder plasma can provide the functionality that previously was achieved using solvents and flux. In the past vacuum plasma batch-process systems were sometimes employed because they operate at low temperatures and do not damage sensitive components. But now Openair^® plasma is a better alternative. It operates at atmospheric pressure, with filtered air and at low temperatures. It provides similar functionality, but it is not restricted to batch processing and it can be employed on high volume production lines.

Already Openair^® plasma is being used in a diversity of applications, including plasma etching of semi conductors, their packaging and the surface treatment of printed circuit boards.

The benefits of Openair^® plasma in electronics manufacturing
Openair^® plasma cleans and functionalizes surfaces. In the case of the production of printed circuit boards when the terminals and vias are treated, all contaminants are removed so the solder makes more complete contact more quickly and popcorning, where solder spits owing to moisture build up, is reduced. Openair^® plasma is almost completely voltage-free so it does not damage components that are sensitive to electrostatic discharge (ESD).

The two key functions of Openair^® plasma are cleaning and surface functionalization, to improve conductivity and adhesion. Openair^® plasma can be used on complex 3-dimensional shapes, removing dust and eliminating organic and silicone-based contaminants.

The process can be used on a variety of electronic components including flexible and non-flexible printed circuit boards, board connectors, LCD display contacts, fluorescent light electrodes, silicon wafers and piezo-electric sensors. Once treated, wire bonding, soldering, potting and conformal coatings flow more easily, wetting the surface more completely, creating components that are more reliable.

Openair^® plasma replaces cleaning processes that use volatile organic components that are often associated with safety and environmental concerns.

Higher throughput manufacturing
Unlike vacuum plasma, Openair^® plasma can be used on production lines operating at high speeds. The process is very reliable and can conform to QS 9000 requirements.

Running costs are low as only power and compressed air are required. And environmental issues are minimized as no ozone or toxic gases are produced.

	Openair® plasma cleans and activates surfaces on a PCB before conformal coating.		Liquid crystal displays are bonded to the contact film. When the film is ripped off the contacts remain bonded (see component on the left).
	Bond wires are de-oxidized with Openair® plasma prior to attaching.		Openair® plasma eliminates the need to wet-chemical treat circuit boards prior to bonding.

We are specialists in using Openair^¨ plasma for the electronics industry.
If you have a potential application please call us.