Trade fair review – Plasmatreat China exhibits its large range of applications at productronica China 2017 in Shanghai

Plasmatreat's sixth exhibition at productronica China once again proved highly successful. Asia’s leading trade fair for the electronics industry, which took place at the Shanghai New International Exhibition Center in March, attracted a record-breaking 68,000 visitors and 1230 exhibitors from 28 countries.

This year Plasmatreat had a team of ten on hand to answer visitors’ questions. They presented the latest applications in the electronics sector under the expert guidance of Calvin Chen, General Manager Plasmatreat China, supported by Thomas Markert, Managing Director Plasmatreat Singapore, Rainer Schobert, Business Development Manager Electronic and Medical, Plasmatreat Deutschland and Ed Laughlin, Sr. Manager International Accounts, Plasmatreat USA. The presentation focused on the following areas: Sealing electronic displays, pretreating electronic components before potting, treating SMD boards with potential-free plasma before conformal coating and the microfine cleaning, simultaneous activation and functional nanocoating of different electronic components for the automotive industry.

The presentation also featured a live attraction in the form of a large, round robotic cell with special inner workings. It housed a type RD8004 plasma rotary jet, a PCU (plasma control unit), a KUKA robot and a turntable with eight sample components and three monitors. Visitors were thrilled to see the robot-controlled plasma rotary nozzle simulating the individual pretreatment of each different electronic component in turn (ECU - electronic control unit -, plug connection, motor pump housing, vehicle battery, SMD circuit board, tablet computer, LED lead frame and sensor), whilst all the data relating to this special application were displayed on the three monitors.

A further highlight of the exhibition was a fascinating talk given by Ed Laughlin (Plasmatreat USA) on “Atmospheric Plasma for Microelectronic IC Package Manufacturing” at the International Adhesive Technology Innovation Forum.

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