Openair-Plasma® - The future of inline surface treatment in advanced semiconductor packaging

Tuesday, 03-14-2023
60 min

Vacuum plasma is used for many applications in the semiconductor industry. But it has its limitations. This is where Openair-Plasma® can assist with its selective surface treatment and inline solutions in various applications.

Openair-Plasma® potential-free microfine cleaning systems are ideal for the production of highly sensitive electrical components. The speed and inline processing that enable new ways for efficient production, the high uniformity of surface treatment independent of product changes and the cost benefits (investment and operating costs) are just a few advantages that can be mentioned.

In this PlasmaTalk, Nico Coenen, our global Market Segment Manager Electronics, covers the differences between vacuum applications and Openair-Plasma® and answers questions such as:

  • Which gases are typically used?
  • What cycle times are we talking about?
  • Case study on cost of ownership.

Additionally, he will present successful applications in the areas of:

  • Wire bonding
  • Die bonding
  • Pre-molding
  • Thermocompression bonding
  • Metal oxide reduction

This no-charge PlasmaTalk is aimed at research, development and quality control personnel as well as designers, process engineers and operators of production equipment in industrial processes.

The PlasmaTalk will last approximately 40-60 minutes plus a question-and-answer session.
If you have a specific question, please send it in advance to so that we can incorporate it into the program.

Please note that due to our international audience, we provide the time slot in UTC (Coordinated Universal Time).
Please check your time zone using the time calculator below (TimeCalc).