Silicon wafers, chips, and high-performance semiconductors are highly sensitive electronic components. As these technologies have developed, so has low-pressure plasma technology as a manufacturing process.
The enhancement of the Openair-Plasma® process under atmospheric pressure opens up entirely new possibilities, in particular for automation. A vacuum is no longer required for plasma treatment, so process flows can be greatly simplified.
DICHT! (Nr.4/ 2017)
DICHTUNGSTECHNIK Jahrbuch 2018