Openair-Plasma® in Electronics Module Assembly
Electronic devices are composed of multiple modules, each assembled using various techniques. In electronics module assembly, proper surface preparation is a critical step to ensure strong and reliable adhesion between different materials. Openair-Plasma® offers precise surface cleaning and activation, enabling secure bonding in applications such as display integration, flexible circuit assembly, and more
High-Tech Bonding for Mobile Telephone Displays: The Best Adhesion Promotion for Solvent-free UV Adhesives
Only minimum surface is available for gluing polycarbonate coverings on half shell cases in the manufacture of mobile telephones. Modern UV adhesives are used – one-component resins that harden in seconds when exposed to UV light through the transparent covering, which ensures very good electrical insulation.
These small surfaces must be extremely well prepared to achieve improved adhesion. Openair-Plasma® activation results in an exceptionally effective joining of advanced materials and combinations with a variety of plastics.
Display - Bezel Bonding
Openair-Plasma® treatment has been successfully used for years to achieve quality finishes on mobile telephone half shells:
- Plasma energy reliably removes all particles using super-fine cleaning.
- Greater surface tension on the plastic casing significantly improves finish dispersion and adhesion and makes it possible to use water-based finishes.
- The scrap rate in the finishing stage of production is significantly reduced.
- Plasma technology can be integrated inline in existing finishing lines.
- Higher production speeds mean noticeable cost savings.
