Improve manufacturing yield in Electronics with Openair-Plasma®
In the production of electronics products, a surface treatment is an essential process to ensure stronger adhesions between different materials, better wettability for coatings and other functionalities. Openair-Plasma® enables in-line, selective, cost effective and environmentally friendly dry surface treatment in atmospheric condition. The applications of Openair-Plasma® in electronics cover semiconductor packaging, PCB assembly, electronics module assembly and electronics components manufacturing.
The introduction of Openair-Plasma® was a milestone in the development of our sensor production.
Benefits of Openair-Plasma® technology
- Selective: switch on and off on the fly
- Super-fine cleaning (component cleaning) without damaging sensitive structures
- Targeted functionalization of surfaces for selective additional processing
- Environmentally friendly: no wet chemicals required
- Cost-effective: operates with oil-free compressed air
- In-line capability: no effect on process time because the plasma process takes less time than the conformal coating process
Openair-Plasma® process
Openair-Plasma® is used to modify surface characteristics so as to enhance the adhesion of materials (such as coatings) to the substrate (PCB). It removes all organic and silicone-based impurities. Oxygen in the form of hydroxyl and ketone groups are incorporated into non-polar surfaces to activate the surface. The result is high surface energy (over 72mN/m) and in most cases, complete wettability.
