The FPC (fine powder coating) process pre-cleans and activates components in a single, environmentally-friendly operation, then selectively deposits metallic coatings in a matter of seconds.
In the electronics industry in particular, FPC can be used to apply functional conductive traces to plastic components – creating circuit boards without the need for gluing, soldering or other process steps.
Plasmatreat is working together with efc plasma GmbH to develop the FPC process.
Plasmatreat will be presenting the highly versatile FPC process from the 16 - 23 October at the K2013 in Düsseldorf.
Please get in touch to arrange an appointment.
ADHESION Adhesives & Sealants (4/2018)
IST (International Surface Technology No.3.2018)
Werkstoffe in der Fertigung (9/2018)