Plasmatreat exhibited its latest developments with great success at PRODUCTRONICA 2015, which was held in Munich from 10 – 13 November. The world's leading trade fair for electronics development and production attracted some 38,000 visitors from 80 different countries.
The focus of this year's stand was the potential-free plasma pretreatment of electronic components and the use of atmospheric pressure plasma in the production of LEDs. Plasmatreat chose to highlight in particular Next Generation developments of Openair® plasma and its sister technology PlasmaPlus® aimed at the electronics industry.
Potential-free pretreatment: Every pretreatment process that conducts electrical potential produces short-circuits on circuit boards, leading to the destruction of layouts and components. Not so with Openair® plasma technology. Together with its stand partner adhesive manufacturer Henkel, the team gave a live demonstration of the potential-free pretreatment of USB sticks: starting with the electronic blank, followed by plasma cleaning and low-pressure encapsulation with a high-performance hot melt. The subsequent functional test provided the proof: Rotary nozzles developed specifically for this type of electronics application have been proven to work with virtually zero-voltage input on the component. The electronics were not damaged in the slightest. But Plasmatreat technology is capable of even more: To make the USB component easier to remove from its injection mold, the tool is pre-coated with PT-Release®, a nano release layer developed by Plasmatreat, which is applied under atmospheric pressure.
LED production: Visitors were particularly interested in the prototype of the new Plasmatreat lead frame handling system, a modular pretreatment station designed for LED production. This system enables the same device to be used for a wide range of different applications, depending on requirements. One module with a particularly small Openair® plasma nozzle developed specifically for electronics, for example, can be used on copper lead frames to reduce oxidation in a quick and environmentally friendly way, whilst the next one – this time using PlasmaPlus® technology – can apply functional coatings to different substrates. These coatings may act as barrier layers, apply a high level of corrosion protection to silver leadframes or provide adhesion protection to silicone.
And it's not just microelectronics that reap the significant benefits of dry, contactless microfine cleaning using atmospheric pressure. Thanks to its high level of activation, stable chip-and-wire bonding connections and optimal adhesion of silicone encapsulation can also be achieved
"We are delighted with the high level of interest in our developments for this sector of industry", says Peter Langhof, Market Manager Electronics. "Whether it be for oxide reduction, semiconductor packaging, PCB activation or other areas of application, visitors to our stand have been won over by the versatility, environmental performance and efficiency of our plasma systems which has led to some promising new customer contacts."