Productronica 2013: Plasmatreat presents latest plasma applications in electronics live

Photo: Plasmatreat
A single operation: The Openair® plasma process fine cleans and simultaneously activates the material surface.

At the international leading trade show for electronics production in Munic Plasmatreat will present its latest plasma applications for manufacturers of the electronics industry. Openair® atmospheric plasma jet technology enables simultaneous microfine cleaning, activation and coating of material surfaces without damaging the sensitive electronics in circuit boards or SMD assemblies, for instance. Virtually potential-free and with in-line capabilities, this atmospheric pressure plasma allows for brand-new applications, which the company will be unveiling at the trade show.

A particular highlight of the event will be a demonstration of the new desmearing process, which visitors will be able to experience live throughout the entire show. This process enables atmospheric pressure plasma to be used for the first time to clean holes drilled in circuit boards or multiple layers for contacting purposes. This important stage is currently performed using elaborate chemical or low-pressure plasma techniques which disrupt the manufacturing process. In contrast, desmearing using the inline Openair® process is done under normal atmospheric conditions, which saves space, simplifies and speeds up the process and substantially reduces costs. “Especially in conjunction with the use of industrial gases, our technology is able to form a strongly abrasive plasma that delivers outstanding selectivity and high removal rates” explains Peter Langhof, Plasmatreat Electronics Marketing Manager.

Visitors will also have the opportunity to manually test the surface tension of their own components live before and after plasma treatment in a special laboratory installed on the stand. Further highlights include the latest FPC (fine powder coating) plasma process which creates functional coatings and effects on plastic surfaces in seconds and an on-screen illustration the reduction of lead frame copper surfaces by means of atmospheric plasma to enhance adhesion during contacting.

Welcome to our booth at the
productronica 2013, 12 - 15 November, Munich, Germany
Hall B2, Stand 117


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