Components are soldered to circuit boards in a cost-effective procedure called a wave soldering process. Up-to-date processes to accomplish this are typically lead-free. Wave soldering involves a higher temperature soldering bath, however, which in turn places greater demands on the adhesion of those components to the printed circuit board.
Surface activation of the components’ surfaces and the chips using Openair-Plasma® has shown a significant improvement in the performance of the adhesive used to fix the components in place for further processing in the solder bath.
ELEKTRONIK-PRAXIS (2/2008)
open document
KUNSTSTOFFE (5/2007)
open document
ADHÄSION (4/2007)
open document
Determining surface tension with dyne inks now
Kunststoffe International 2/2022
Whitepaper Actega April 2021
Kunststoffe International - Issue 2/2021
Put Openair-Plasma® to the test with our rental and test systems.
We are giving away 2 tickets for the Future Battery Forum in Berlin.
The show will take place from November 15 - 16, 2021 and the event is completely sold out.
Plasmatreat USA exhibits at MD&M West 2021 in Anahem in August and will show exciting solutions for surface treatment of medical devices.
Plasmatreat constantly faces shifting demands as a result of new ideas, regulations, and standards. Customers are increasingly approaching the company with unique and innovative project requests. Consequently, the capacities of the technology and research center will now be expanded to include a class-6 cleanroom.
Find the Best Solution for Your Product and Use Case
