Secure Joining–Reliable Wire Bonding with Plasma Cleaning of Contact Surfaces

After chips are created (diced out of the wafer) and separated, they are packaged by attaching them to lead frames and then providing them with housings. Secure joining, wire bonding, of the chip to the leads of the lead frame is critical for the reliable functioning of the integrated circuit. Wire bonding is generally performed in an ultrasound procedure, and for that step in the process, the contact surfaces must be perfectly clean.

Plasma activation for secure adhesion of electronic components and cable insulation sheaths

Dry super-fine cleaning with Openair-Plasma® reliably removes all contaminants and carbohydrate residues. The result is secure bonding and a significant reduction in error rates.

/Tags/Elektronik/Wafer, /Tags/Elektronik/Wafer-rechts, /Tags/Elektronik/Wafer, /Tags/Elektronik/Wafer-rechts, /Wafer, /Wafer-rechts, /Tags/Elektronik/Wafer, /Tags/Elektronik/Wafer-rechts, /Tags/Elektronik/Wafer, /Tags/Elektronik/Wafer-rechts, /Tags/Elektronik/Wafer, /Tags/Elektronik/Wafer-rechts, /Tags/Elektronik/Wafer, /Tags/Elektronik/Wafer-rechts, /Tags/Elektronik/Wafer, /Tags/Elektronik/Wafer-rechts, /Tags/Elektronik/Wafer, /Tags/Elektronik/Wafer-rechts, /Tags/Elektronik/Wafer, /Tags/Elektronik/Wafer-rechts, /Tags/Elektronik/Wafer, /Tags/Elektronik/Wafer-rechts, /Tags/Elektronik/Wafer, /Tags/Elektronik/Wafer-rechts, /Tags/Elektronik/Wafer, /Tags/Elektronik/Wafer-rechts

Related press articles

Plasma beam cleans and activates covering and sealing surfaces

open document

"Give Leaks No Chance" - Plasma-pre-treatment protects electronics

open document

Secure protection for electronic components

ADHÄSION (4/2007)
open document


We are looking forward to your inquiry

In case of questions or suggestions, we are happy to help you. We look forward to your challenge. Here you find your personal contact for your inquiry.