After chips are created (diced out of the wafer) and separated, they are packaged by attaching them to lead frames and then providing them with housings. Secure joining, wire bonding, of the chip to the leads of the lead frame is critical for the reliable functioning of the integrated circuit. Wire bonding is generally performed in an ultrasound procedure, and for that step in the process, the contact surfaces must be perfectly clean.
Dry super-fine cleaning with Openair® Plasma reliably removes all contaminants and carbohydrate residues. The result is secure bonding and a significant reduction in error rates.