Wafer manufacturing begins with a block of semiconductor material. This is sliced (sawed) into wafers, which are then polished in a chemical/mechanical process until the required surface roughness of a few nanometers is achieved.
In the next step, Openair-Plasma® is used as a highly efficient and simple procedure for super-fine cleaning of these nano-structures. One hundred percent of carbohydrates and particles are removed and error rates can be significantly reduced using this Openair-Plasma® cleaning.
ELEKTRONIK-PRAXIS (2/2008)
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KUNSTSTOFFE (5/2007)
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ADHÄSION (4/2007)
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Determining surface tension with dyne inks now
Kunststoffe International 2/2022
Whitepaper Actega April 2021
Kunststoffe International - Issue 2/2021
Put Openair-Plasma® to the test with our rental and test systems.
We are giving away 2 tickets for the Future Battery Forum in Berlin.
The show will take place from November 15 - 16, 2021 and the event is completely sold out.
Plasmatreat USA exhibits at MD&M West 2021 in Anahem in August and will show exciting solutions for surface treatment of medical devices.
Plasmatreat constantly faces shifting demands as a result of new ideas, regulations, and standards. Customers are increasingly approaching the company with unique and innovative project requests. Consequently, the capacities of the technology and research center will now be expanded to include a class-6 cleanroom.
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