Openair-Plasma® in PCB Assembly
Printed Circuit Boards(PCBs) are used in nearly all electronic products today and are used to connect or "wire" components to one another in an electronic circuit. As electronic components are used in harsh environment, the demand for corrosion protection is growing. From vehicle interiors and engine compartments in automotive, defense and aerospace applications - the use of conformal coating to protect electronic components is now virtually imperative. This is the only was to safely ensure the required performance and reliability for the entire life of the PCBs and beyond. Openair-Plasma® provides surface cleaning & activation before conformal coating and PlasmaPlus® provides nano-coating which acts as conformal coating itself.
Openair-Plasma® before Conformal Coating
- Coating Challenges -
Common issues in the conformal coating process are orange peel, bubbles, delamination, uneven coatings and cracks. These may be caused by the coating material, the circuit board, the component quality, the oven profile, impurities or even the application process.
- The solution: Openair-Plasma® -
Pretreatment with Openair-Plasma® will help to eleminate these challenges and ensures a high quality and reliable end product. Increased surface energy allows the coating material to flow more evenly and prevents the formation of bubbles. Improved adhesion of the coating combined with plasma fine-cleaning safely prevents delamination or dewetting.
PlasmaPlus® Conformal Coating
The PlasmaPlus® coating procedure takes things one step further: With a very energy-rich Openair-Plasma®, an extremely thin, solvent-free plasma polymer coating is applied creating a layer thickness of just 500 to 1000 nanometers. Not only does this layer provide protection against corrosion and environmental influences, but it also provides outstanding electrical isolation that can withstand voltages ranging from 50 V to several kilovolts and prevents the formation of dendritic structures which can often cause short circuits.
Flux Residue Cleaning
Flux can cause electrical failures if it remains on substrate.
HydroPlasma® combines the powerful effects of Openair-Plasma® with the chemical reactivity of water molecules to efficiently tackle even the most stubborn dirt and contaminants. Water is introduced into the plasma process and ionized, creating water molecules that provide a cleaning effect similar to dish soap—without the need for any chemical additives.
The cleaning action is applied precisely to the surface through a specially designed nozzle, effectively removing both organic residues like oils and greases and inorganic contaminants such as salts. These contaminants are transformed into soluble or gaseous components, ensuring a thorough clean. For more demanding applications, the cleaning effect can be further enhanced with targeted additives.
HydroPlasma® is a versatile, environmentally friendly, and highly effective solution for a wide range of cleaning challenges
ADVANTAGES &
PROPERTIES
of Openair-Plasma® technology
- Selective: switch on and off on the fly
- Environmentally friendly: no wet chemicals required
- Cost-effective: operates with oil-free compressed air
- In-line capability: no effect on process time because the plasma process takes less time than the conformal coating process
