Vacuum plasma has been used for many applications in the semiconductor industry. In the Openair-Plasma® process, a “reactive plasma zone” integrated into the plasma unit makes it possible to carry out continuous pretreatment during the ongoing production process. The potential-free Openair-Plasma® microfine cleaning system is ideal for the production of highly sensitive electrical components, replacing the vacuum chamber in the production of chip packaging in a much more efficient and cost-effective way. The method ensures a fast inline process and guarantees perfect uniformity regardless of your process and product.
in semiconductor manufacturing
- Selective area treatment possible
- High-speed treatment: Up to 1.5m/sec.
- Potential-free: < 1V, can also be used on sensitive electronics
- Cost-effective: Low investment and operating costs
- Flexible: Adaptable to all surfaces (flat or 3D)
- Environmentally friendly: No solvents thanks to the use of compressed air, VOC free technology
- Dual lane concept
- Bar code scanning
- Control modules by PCU
- 100% yield and high-end product quality
Until now, unwanted oxide layers could only be removed prior to soldering or bonding processes by means of vacuum plasma chamber technology in a time-consuming and costly process. Openair-Plasma® microfine cleaning replaces the vacuum chamber in the production of chip packaging. A “reactive plasma zone” integrated into the plasma unit makes it possible to carry out continuous pretreatment during the ongoing production process.
Openair-Plasma® cleans surfaces, thus ensuring improved adhesion of die bond material and of soft solder. The strengthened bond between die and substrate that results from this in turn has a positive effect on heat dissipation. The high surface energy ensures that dies adhere without cavities. In addition, the higher surface energy achieved by the Openair-Plasma® process allows soft solder to be applied 50% faster. The Openair-Plasma® jets can also be integrated into existing die bonders.
In the thermal compress bonding process, dies can be placed and bonded to the pad by applying heat and pressure in a single step. As a result, the dies do not have to be subjected to a high temperature cycle in the reflow oven. This is especially advantageous for thin dies because they can deform when exposed to heat, thus resulting in failures. Moreover, the Openair-Plasma® process enables to treat the part selectively and avoids a full treatment of the part. This is a major advantage over methods commonly used in the past, which can only treat pads in their entirety. A plasma pre-treatment before applying flux ensures a perfect bond.
As standardized processes in electronics manufacturing, plasma processes ensure clean pads prior to wire bonding. However, a vacuum process entails challenges in terms of process duration and homogeneity. The Openair-Plasma® process can not only be integrated into the production line, but also yields consistent results in seconds regardless of batch size or process time.
Here, the Openair-Plasma® process delivers higher substrate surface energy, thus providing a stronger bond between the components and encapsulation materials. The result is a more reliable and productive overall package.