반도체 제조의 Openair-Plasma®
진공 플라스마는 반도체 산업에서 다양한 응용 분야에 사용되어 왔습니다. Openair-Plasma® 공정에서는 플라스마 장치에 통합된 "반응성 플라스마 존"을 통해 진행 중인 생산 공정 중에도 지속적인 전처리를 수행할 수 있습니다. 무전위 Openair-Plasma® 초미립자 세정 시스템은 매우 민감한 전기 부품 생산에 이상적이며, 칩 포장 생산에서 진공 챔버를 훨씬 더 효율적이고 비용 효율적인 방식으로 대체할 수 있습니다. 이 방법은 빠른 인라인 공정을 보장하고 어떤 공정과 제품을 사용하든 완벽한 균일성을 보장합니다.
Interface quality is crucial
Plasma cleans and activates surfaces inline, quickly and in a controlled manner. In the semiconductor industry in particular, this enables highly particle-free process control, which reduces waste and increases quality. In addition to perfect adhesion and optimal wettability, service life and product stability also benefit: interface failures such as delamination (IDM) or internal cracking (CCM) can be significantly minimized through targeted plasma pretreatment.
Modern semiconductor products consist of complex multi-material systems – from metal/metal to metal/polymer to various polymer combinations. Their reliability depends crucially on how cleanly and permanently the material interfaces are bonded. Even the smallest defects at these interfaces lead to delamination, cracks, or unexpected failures.
Four main factors jeopardize this critical interface quality:
- oxides that form in the wrong places
- poor wettability of surfaces
- contamination by particles and residues
- different coefficients of thermal expansion (CTE mismatch)
All these challenges can now be effectively addressed with plasma technology – without the use of harmful chemicals, cost-intensive vacuum technology, or expensive specialty gases.
비진공 공정 - 반도체 제조의 새로운 가능성을 열어주는 Openair-Plasma®
실리콘 웨이퍼, 칩, 고성능 반도체는 매우 민감한 전자 부품입니다. 이러한 기술이 발전함에 따라 제조 공정으로서의 진공 플라스마 기술 도 발전했습니다.
대기압 내에서의 Openair-Plasma® 공정 강화는 특히 자동화를 위한 완전히 새로운 가능성을 열어줍니다. 플라스마 처리에 진공이 더 이상 필요하지 않으므로 공정 흐름을 크게 단순화할 수 있게 되었습니다.
Die Attachment and Interconnection
A perfect connection is at the heart of every modern semiconductor packaging process. Contaminated, poorly prepared surfaces lead to bonding errors, delamination, “non-stick on pad” and premature failures. In processes such as wire bonding, die bonding (flip chip) and modern adhesive bonding, the quality of the surface determines reliability and performance.
Openair-Plasma® cleans and activates all critical surfaces—substrate, bond pads, chip/die. Oxide layers and disruptive residues are removed, and wettability and adhesion are optimally adjusted.
Thermo-Compression Bonding (TCB)—Plasma ensures perfect flux-free connections
With Openair-Plasma® and REDOX® process, you create the perfect conditions for demanding bonding processes – for reliable advanced packages and high-end applications.
The result:
- Stable, void-free connections without the use of flux
- Maximum process reliability and repeatability
- Conducive to environmentally friendly and cost-efficient production
Maximum electrical and mechanical reliability
Encapsulation Preparation
Stable, long-term reliable protective encapsulation is the backbone of modern semiconductor components. However, even the best encapsulation material can only achieve its full effect if the surfaces are optimally prepared. Invisible residues, oxides, or poor wettability quickly lead to delamination, air pockets, or defects—thus jeopardizing the electrical performance and long-term stability of the package.
Targeted plasma activation prior to encapsulation creates perfect surface conditions: The encapsulant can be distributed reliably and without bubbles, adheres to all relevant materials, and thus ensures long-lasting and comprehensive protection – even under the most demanding conditions.
Surface Preparation for Molding and Encapsulation
The surface quality of the substrate is crucial for reliable molding and protective encapsulation. It is essential that all materials involved—from lead frames and fine wires to sophisticated encapsulants—are optimally cleaned, free of oxidation, and reactive. This is the only way to ensure a seamless material flow, maximum adhesion, and absolute long-term stability.
Openair Plasma® offers several specialized processes:
- Plasma cleaning removes all organic and inorganic residues that could impair adhesion or cause delamination.
- Plasma reduction removes even the finest metal oxides and creates highly active, chemically bondable surfaces.
- PlasmaPlus® Nano Coating (Conformal Coating) applies a thin, homogeneous barrier that protects against moisture and further increases material compatibility.
In combination, these processes ensure optimal flow of the potting material, prevent air pockets, and enable full compliance with REACH and MSL1 requirements—for maximum reliability even under the toughest production and operating conditions.
Final Assembly Cleaning & Marking
The perfect finish to any semiconductor manufacturing process is crucial for delivery quality and functionality. Contamination from dust, handling, or residues often occurs during final assembly, which can compromise product safety and markability. At the same time, important markings such as barcodes, serial numbers, and laser engravings are applied here, which must adhere permanently and precisely.
This is where Openair Plasma® comes in: directly before packaging, marking, or ejection, inline plasma cleaning ensures absolutely flawless surfaces. This removes even the last particles, giving each component the “finishing touch” – flawless and ready for use. Innovative features such as barcode reader and dual lane integration, as well as intelligent PCU control, make the process flexible, scalable, and maximally reliable.
Your advantages:
- Particle- and residue-free end products right up to the delivery point
- Secure, permanent marking on any surface
- Highest yield rates thanks to minimized scrap
- Process reliability and quality assurance right up to the final production step
The finishing touch for perfection:
Only with clean, optimally prepared end products can you ensure genuine production reliability and delight your customers with every delivery – from start to finish.
