Before molding or encapsulation, the surface condition of the substrate is critical for adhesion, material flow and long-term reliability. Different materials – from lead frames and wires to encapsulants – require clean, oxide-free, and reactive surfaces to ensure a defect-free process.

• Plasma Cleaning: Removes organic and inorganic residues that would otherwise interfere with adhesion or cause delamination.
• Plasma Reduction: Reduces metal oxides, creating a clean and active surface for strong chemical bonding.
• Nano Coating (Conformal Coating): Forms a thin, uniform barrier layer that protects against moisture and improves material compatibility.

This combination ensures good encapsulant flow, prevents air entrapment, and achieves REACH and MSL1 compliance for maximum reliability under harsh environmental and reflow conditions.