Openair-Plasma® in PCB Assembly
Printed circuit boards (PCBs) are found in virtually all modern electronic devices, serving as the backbone for connecting and routing components within electronic circuits. As these components are increasingly exposed to harsh environments, the demand for effective corrosion protection continues to rise. Whether in vehicle interiors, engine compartments, or critical systems in the aerospace and defense sectors — conformal coatings have become essential to ensure long-term performance and reliability.
To meet these stringent demands, Openair-Plasma® offers precise surface cleaning and activation prior to conformal coating application. Additionally, PlasmaPlus® enables the deposition of a functional nano-coating that can serve as a conformal coating itself — providing enhanced protection and performance over the entire lifecycle of the PCB.
Openair-Plasma® before Conformal Coating
Typical issues encountered during the conformal coating process include orange peel texture, bubble formation, delamination, uneven coating thickness, and cracking. These defects can originate from a variety of sources — such as the coating material itself, the PCB surface condition, component quality, oven curing profiles, contamination, or flaws in the application process.
The solution: Openair-Plasma®
Pretreatment with Openair-Plasma® will help to eleminate these challenges and ensures a high quality and reliable end product. Increased surface energy allows the coating material to flow more evenly and prevents the formation of bubbles. Improved adhesion of the coating combined with plasma fine-cleaning safely prevents delamination or dewetting.
PlasmaPlus® Conformal Coating
The PlasmaPlus® coating procedure takes things one step further: With a very energy-rich Openair-Plasma®, an extremely thin, solvent-free plasma polymer coating is applied creating a layer thickness of just 500 to 1000 nanometers. Not only does this layer provide protection against corrosion and environmental influences, but it also provides outstanding electrical isolation that can withstand voltages ranging from 50 V to several kilovolts and prevents the formation of dendritic structures which can often cause short circuits.
Flux Residue Cleaning
Flux can cause electrical failures if it remains on substrate.
HydroPlasma® combines the powerful effects of Openair-Plasma® with the chemical reactivity of water molecules to efficiently tackle even the most stubborn dirt and contaminants. Water is introduced into the plasma process and ionized, creating water molecules that provide a cleaning effect similar to dish soap—without the need for any chemical additives.
The cleaning action is applied precisely to the surface through a specially designed nozzle, effectively removing both organic residues like oils and greases and inorganic contaminants such as salts. These contaminants are transformed into soluble or gaseous components, ensuring a thorough clean. For more demanding applications, the cleaning effect can be further enhanced with targeted additives.
HydroPlasma® is a versatile, environmentally friendly, and highly effective solution for a wide range of cleaning challenges
Glob Top
To ensure optimal adhesion of the glob top, plasma surface treatment improves bonding strength and provides superior long-term protection and reliability.
Treatment Before Enclosure Bonding
Whether the substrate is plastic or aluminum, plasma treatment ensures optimal functionality of the gasket — whether it's a liquid seal or a solid one. For applications requiring a perfectly tight seal, PlasmaPlus® can be applied to protect the aluminum housing from corrosion and enhance sealing performance.
ADVANTAGES &
PROPERTIES
of Openair-Plasma® technology
- Selective: switch on and off on the fly
- Environmentally friendly: no wet chemicals required
- Cost-effective: operates with oil-free compressed air
- In-line capability: no effect on process time because the plasma process takes less time than the conformal coating process
