Leggete qui le nostre notizie e i nostri articoli:

Plasmatreat North America Highlights Products for Semiconductor Packaging at IMAPS

Innovative surface pretreatment for plastic, composite, and metal profiles—efficient, primer-free, and sustainable

Using compressed air and electricity to improve the processing of lightweight materials

Lukas Buske gives insights in electronics and semiconductor industry.

Plasmatreat Nordic has entered into a strengthened collaboration with Beckhoff Automation Sweden, marking an important step in expanding both companies’ joint presence in the Scandinavian market.

Euroguss 2026: From fine cleaning to corrosion protection: Preparing metal surfaces specifically for subsequent processes

Plasmatreat at productronica and SEMICON Europa: From front-end and back-end/packaging to lead frames and printed circuit boards

Kick-off for year 2026 in Erfurt: In a motivational meeting, the team structure was presented, goals were defined, and the focus was placed on the future.

Collaboration between Plasmatreat and Neue Materialien Bayreuth: Successful use of Openair-Plasma for efficient, environmentally friendly coating application

The actual interview with Holger Timpe was quick, and then I started right away.