Openair-Plasma®
The basis of our plasma technology—tried and tested for over 30 years. With Openair-Plasma®, our customers replace conventional chemical pre-treatments with dry, precise activation and cleaning of the surface. The process is fully inline-capable and enables considerable savings in energy, resources and emissions.
HydroPlasma®
With water as an additional process medium, our plasma cleaning technology goes one step further. HydroPlasma® removes not only organic but also inorganic residues—such as fingerprints—in a particularly environmentally friendly way. Ideal for sensitive surfaces and high-purity applications.
PlasmaPlus®
With PlasmaPlus®, we apply functional coatings directly to the activated surface—without any VOCs, solvents or energy-intensive drying. Defined precursors allow adhesion promoters, barrier layers or corrosion-inhibiting layers to be applied in a targeted manner—exactly where they are needed.
REDOX® Plasma
In combination with reactive process gases, we create targeted reduction and oxidation conditions on the surface—without any liquid chemicals. This expansion of plasma functionality opens up new possibilities, e.g. in electronics production or for metallic substrates with the highest purity requirements.
Interesting Applications for Surface Modifications
Plasma Reduction
Oxide layers on metal surfaces can pose challenges in processes like soldering and bonding. The REDOX®-Tool, an innovation within the Openair-Plasma® suite, offers an inline solution for oxide reduction. By utilizing atmospheric pressure plasma, this tool efficiently reduces metal oxides, eliminating the need for traditional fluxes and enabling flux-free soldering processes.
Interesting Applications for Surface Modifications
Plasma Reduction
Oxide layers on metal surfaces can pose challenges in processes like soldering and bonding. The REDOX®-Tool, an innovation within the Openair-Plasma® suite, offers an inline solution for oxide reduction. By utilizing atmospheric pressure plasma, this tool efficiently reduces metal oxides, eliminating the need for traditional fluxes and enabling flux-free soldering processes.