Plasma for Stable Surface Processes in Chip Manufacturing
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When the European semiconductor industry gathers at SEMICON Europe in Munich from November 10 to 13, 2026, Plasmatreat will demonstrate at Booth 567 in Hall C1 how surfaces can be specifically tailored to meet the requirements of subsequent manufacturing steps. Whether it’s die attach, wire bonding, hybrid bonding, TCB, underfill, molding, or encapsulation processes: Controlled surface conditions that reliably support wetting, adhesion, contact formation, and long-term reliability are crucial for consistent results. To achieve this, Plasmatreat combines various plasma processes to remove organic residues, reduce oxide layers, improve wetting and adhesion, or specifically tailor surface properties for subsequent manufacturing steps. At the booth, visitors will experience the new AURORA-Plasma system for low-pressure processes, DBD-based GlowPlasma technology for homogeneous wafer treatment, specialized Openair-Plasma jets for particle- and potential-free applications, and processes for dry oxide reduction on metallic contact surfaces.
In semiconductor manufacturing, the condition of the surface often determines the stability and reproducibility of subsequent manufacturing steps. Depending on the application, organic residues must be removed, oxide layers reduced, wetting and adhesion improved, or specific surface properties achieved. At the same time, demands for process control, automation, traceability, and cleanroom compatibility are increasing. That is why Plasmatreat selects the appropriate plasma solution for each application based on the substrate material, purity requirements, process step, and production environment. The goal is to achieve controlled surface conditions that support stable process windows, reproducible manufacturing results, and high yields.
The Right Plasma Technology for Every Process Requirement
Different process steps in semiconductor manufacturing place different demands on the surface. While the removal of organic residues or oxide layers is a priority in bonding and interconnect processes, wetting, adhesion, and long-term stability are often critical in underfill, molding, or encapsulation applications.
Plasmatreat offers three complementary plasma technologies for this purpose: Openair-Plasma for atmospheric-pressure processes, AURORA-Plasma for low-pressure processes, and PlasmaPlus for functional surface coatings. The Openair-Plasma portfolio includes specialized processes such as GlowPlasma for homogeneous wafer and panel treatments, the REDOX-Tool for targeted oxide reduction, and HydroPlasma for demanding cleaning tasks.
Depending on the requirements, surfaces are cleaned, activated, prepared to be oxide-free, or specifically modified with functional layers. The goal is not the plasma treatment itself, but rather the targeted establishment of reproducible surface conditions for the respective process step. This application-oriented approach forms the basis for selecting and integrating the appropriate solution throughout the entire chip and packaging value chain.
Premiere at SEMICON: AURORA-Plasma in Live Operation
For the first time, Plasmatreat is presenting a system from the AURORA-Plasma product family at SEMICON Europe. The GHz remote plasma technology generates the plasma outside the process chamber, enabling treatment without direct ion exposure at low substrate temperatures. The uniform plasma distribution reaches three-dimensional structures and complex topographies without a shadow effect. Thanks to its fine-pitch capability, the technology is also suitable for feature sizes under five micrometers. Solutions are available for wafers up to 300 millimeters, as well as systems designed for panels up to 900 × 900 millimeters.
The automated AURORA 450 will be on display in live operation at the booth. A robotic system handles the loading and unloading of wafers and leadframes. With this demonstration, Plasmatreat showcases the integration of the low-pressure plasma process into automated mass production workflows.
Contactless Wafer Handling and Plasma Processes at Atmospheric Pressure
Beckhoff’s XPlanar demo system combines contactless wafer handling with integrated atmospheric-pressure plasma treatment. It transports wafers without contact between process stations, thereby preventing mechanical abrasion. The PDW100 and PFA10 plasma jets, developed for semiconductor applications, are used. The demonstration builds on the XPlanar concept already presented at SEMICON Europe 2025.
The DBD-based PDW100 embodies GlowPlasma technology for the homogeneous, surface-wide cleaning and activation of sensitive wafer and panel surfaces. As a ZERO-particle jet, it is designed for ISO Class 4 cleanrooms. The PFA10, on the other hand, enables the localized treatment of bon pads, dies, and substrates.
Plasma treatment is performed immediately prior to critical manufacturing steps and aids in the removal of organic impurities as well as in establishing reproducible wetting and adhesion properties. This results in stable interfaces and reproducible conditions for subsequent bonding and packaging processes. At the same time, Plasmatreat demonstrates how atmospheric plasma processes can be integrated into automated manufacturing environments. The combination of contactless transport and plasma treatment enables a continuous, low-contamination material flow for demanding semiconductor applications.
Oxide Reduction on Metallic Contact Surfaces
Plasmatreat will demonstrate how oxide layers can be removed in a targeted and reproducible manner during a live demonstration of oxide reduction at atmospheric pressure. Using copper surfaces as an example, the demonstration will show how oxide layers can be prepared for subsequent manufacturing steps using a dry, selective process without wet chemical treatment.
For bonding, contacting, and packaging processes, controlled surface conditions are an essential prerequisite for stable electrical, thermal, and mechanical connections. The REDOX process reduces oxide layers immediately before the joining step, thereby promoting wetting, contact formation, and process stability.
At the same time, Plasmatreat will demonstrate that the plasma jets used are potential-free. Trade show visitors can observe the measurements directly at the booth and assess how the technology can also be applied to sensitive electronic components and demanding semiconductor applications.
Process Control and Traceability for Mass Production
For quality-critical semiconductor processes, not only the plasma treatment itself but also stable process conditions and seamless traceability are crucial. That is why Plasmatreat is showcasing its latest control and monitoring solutions at SEMICON Europe.
The Plasma Control Unit (PCU) continuously monitors relevant process parameters and supports reproducible process control throughout the entire production cycle. Recipe management, real-time monitoring, and documentable process data facilitate the transfer of qualified processes from development and pilot production to mass production. At the same time, it improves traceability in quality-critical manufacturing environments.
Through standardized industry interfaces such as SECS/GEM, SMEMA, Profinet, or EtherCAT, the systems can be integrated into automated production lines and connected to existing factory automation and monitoring systems. In this way, Plasmatreat combines surface treatment, process control, and automation into a comprehensive manufacturing concept. The combination of a plasma source, PCU, and jet and low-pressure technology supports stable process windows, reproducible results, and high yield rates in semiconductor manufacturing.
“In semiconductor manufacturing, there is no single plasma technology that works for all applications,” explains Nico Coenen, Global Director of Electronics Markets at Plasmatreat. “The key is to precisely control the surface condition prior to each process step. That’s why we combine Openair-Plasma, AURORA-Plasma, and PlasmaPlus with specialized processes such as GlowPlasma, REDOX-Tool, and HydroPlasma to create a solution tailored to the specific application. In this way, we support our customers from wafer-level processes all the way through to packaging and back-end applications.”