Discover how the new AURORA product series expands the Plasmatreat technology portfolio with uniform full-surface cleaning and activation under defined vacuum conditions, scalable from trials to high volume manufacturing.
When full-surface preparation must be stable, uniform and reproducible, low pressure plasma is a strong option. It enables controlled cleaning and activation as a reliable basis for downstream steps such as bonding, sealing or further processing.
In this PlasmaTalk, you will get a practical overview of low pressure plasma for industrial materials processing, focused on production relevance: controllable process chemistry, repeatability, and robust process transfer into manufacturing.
Why low pressure plasma
Low pressure plasma runs under defined process conditions inside a vacuum chamber. Process gases can be dosed in a controlled way, supporting repeatable results with less influence from ambient air. This is particularly valuable for complex geometries, sensitive surfaces, and uniform full-surface treatment requirements.
How AURORA and Openair-Plasma® complement each other
Openair-Plasma® is ideal for local, selective and inline pretreatment at atmospheric pressure, especially when cycle time and integration into existing production lines are key. AURORA uses low pressure plasma in a vacuum chamber and is designed for uniform full-surface treatment under defined conditions, for example when geometries are complex or surfaces are sensitive. In many manufacturing setups, the best approach is not either-or, but choosing the right tool for the specific surface task.
What the PlasmaTalk covers
We focus on two capabilities of AURORA:
- Cleaning: removal of organic residues and process contamination for consistent downstream processing
- Activation: improved wetting and adhesion, and what it takes to stabilize recipes for production
Industries and application examples
You will see how these capabilities translate into real manufacturing needs, including semiconductor (frontend and backend), medical devices, aerospace and automotive, textiles and membranes, and microfluidics.
