Openair-Plasma® in Semiconductor Packaging
Semiconductor Packaging is an essential part of semiconductor manufacturing. In order to ensure best performances for IC chips, reliable interconnections, IC chip protections and better heat dissipations are required. In Semiconductor Packaging surface contaminants such as organic residues or oxide layers are always hindrances for reliable interconnections. Also usages of electronics devices in harsh environment deteriorate IC chip performance. Openair-Plasma® provides surface cleaning & activation, oxide reduction and anticorrosion or adhesion promotor nano-coating to address these challenges and improve manufacturing yield.
Cleaning
Organic residues on surfaces can be hindrances at interconnections such as Wire Bonding. In Wire Bonding organic residues cause issues such as Non-Stick on pad, poor shear strength or wire pull strength, wire pull, etc. Openair-Plasma removes organic residues and improves adhesion strengh in interconnections and ensures high reliability of devices.
Activation
Plasma surface treatment using Openair-Plasma® can be used to optimize processes in wire bonding, die bonding, thermal compression bonding and pre-moulding. In contrast to vacuum systems, which are typically filled with magazines in a batch process and whose cleaning results are sometimes irregular. components are treated individually inline with Openair-Plasma®. This ensures fast and uniform surface treatment. Integrated process controls ensure the desired surface properties with high reproducibility. It is also possible to integrate Openair-Plasma® inline into existing systems.
Oxide Reduction
Oxide layer is also a hindrance in interconnections of semiconductor devices such as CPU(Central Processing Unit), Power Devices, etc. RedOx-Tool with Openair-Plasma technology enables in-line oxide reduction in these inteconections and improves prodution yield in the process.
For more information about Power Devices and RedOx-Tool please check here.
RedOx-Tool
Oxide reduction on Leadframe with RedOx
Coating: Protection
IC chips need to be protected from outer environment. Moistures propagate between layers of signal or power lines and can damage functionalities of IC chips. PlasmaPlus enables atmospheric plasma enhanced coating and deposit layers of protection in the range of 700 nm to 1,000 nm(depending on application) for protection.
Coating: Adhesion Promotor
In Semiconductor Packaging poor adhesion between different materials cause reliability failures. When semiconductor devices experience harsh environment with temperature cycles the adhesion issues are encountered more. PlasmaPlus ahesion promotor enables a stronger adhesion between different materials and ensure a high reliability of semiconductor devices.
FEATURES OF
OPENAIR-PLASMA®
in semiconductor manufacturing
- Selective area treatment possible
- High-speed treatment: Up to 1.5m/sec.
- Potential-free: < 1V, can also be used on sensitive electronics
- Cost-effective: Low investment and operating costs
- Flexible: Adaptable to all surfaces (flat or 3D)
- Environmentally friendly: No solvents thanks to the use of compressed air, VOC free technology
